Reducing thermal mismatch stress in anodically bonded silicon–glass wafers: theoretical estimation-Reference-Cited by-同舟云学术

Reducing thermal mismatch stress in anodically bonded silicon–glass wafers: theoretical estimation

Published:2017-01-23 Issue:1 Volume:16 Page:015003
ISSN:1932-5150
Container-title:Journal of Micro/Nanolithography, MEMS, and MOEMS
language:en
Short-container-title:J. Micro/Nanolith. MEMS MOEMS

Author:

Sinev Leonid S.¹,Ryabov Vladimir T.²

Affiliation:

1. Dukhov Research Institute of Automatics (VNIIA), 22, ul. Sushchevskaya, Moscow 127055, Russia

2. Bauman Moscow State Technical University, 5/1, ul. Baumanskaya 2-ya, Moscow 105005, Russia

Publisher

SPIE-Intl Soc Optical Eng

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference15 articles.

1. Integration possibilities with MOEMS/MEMS devices and packaging technologies using a MEMS simulation tool

2. Investigation of residual stress influence on CMUT in standard CMOS process

3. Residual Stress in Capacitive Micromachined Ultrasonic Transducers Fabricated with Anodic Bonding Using SOI Wafer

4. Effect of Axial Force on the Performance of Micromachined Vibratory Rate Gyroscopes

5. Curvature changing or flattening of anodically bonded silicon and borosilicate glass

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