Image feature analysis of plasma spot produced from femtosecond laser ablation for silicon wafer-Reference-Cited by-同舟云学术

Image feature analysis of plasma spot produced from femtosecond laser ablation for silicon wafer

Published:2017-06-27 Issue:2 Volume:16 Page:025003
ISSN:1932-5150
Container-title:Journal of Micro/Nanolithography, MEMS, and MOEMS
language:en
Short-container-title:J. Micro/Nanolith. MEMS MOEMS

Author:

Wang Fu-bin¹,Zhao Li-hong²,Tu Paul³,Liu Yang⁴,Chen Jian-xiong³

Affiliation:

1. North China University of Science and Technology, School of Electrical Engineering, Tangshan, Hebei, ChinabUniversity of Calgary, Department of Mechanical and Manufacturing Engineering, Calgary, Alberta, Canada

2. Northeastern University, School of Information Science and Engineering, Shenyang, Liaoning, China

3. University of Calgary, Department of Mechanical and Manufacturing Engineering, Calgary, Alberta, Canada

4. North China University of Science and Technology, School of Electrical Engineering, Tangshan, Hebei, China

Publisher

SPIE-Intl Soc Optical Eng

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference16 articles.

1. Periodical structures induced by femtosecond laser on metals in air and liquid environments

2. Ultrafast spectroscopy and applications based on TI: sapphire femtosecond laser;Yang,2000

3. Closed-loop control in ultrafast laser milling process using laser triggered plasma

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