Investigation of two-layer aluminum cold plate for high-power RF linear chip array cooling-Reference-Cited by-同舟云学术

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Investigation of two-layer aluminum cold plate for high-power RF linear chip array cooling

Published:2024-04-01 Issue: Volume:58097 Page:18
ISSN:
Container-title:Third International Conference on Computer Technology, Information Engineering, and Electron Materials (CTIEEM 2023)
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Author:

Wei Tao,Ma Yupu,Zhao Jianfa,Zhang Yusheng

Publisher

SPIE

Reference14 articles.

1. PA Thermal Management and Packaging: Wideband PA and Packaging, History, and Recent Advances: Part 2

2. Embedded Cooling for Wide Bandgap Power Amplifiers: A Review

3. Near-junction microfluidic thermal management of rf power amplifiers;Bar-Cohen,2015

4. State of the art of electronics cooling for radar antenna applications;Upadhya,2017

5. Thermal solution of high flux phased radar antenna for military application;Parlak,2015

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