Wafer alignment mark placement accuracy impact on the layer-to-layer overlay performance

Author:

van Haren Richard J. F.,Steinert Steffen,Mouraille Orion,D’havé Koen,van Dijk Leon,Hermans Jan,Beyer Dirk

Publisher

SPIE

Reference7 articles.

1. Extending immersion lithography down to 1x nm production nodes;Boeij,2013

2. The impact of the reticle and wafer alignment mark placement accuracy on the intra-field mask-to-mask overlay;Haren,2019

3. EBM-5000: Electron beam mask writer for 45 nm node;Sunaoshi,2006

4. In-die photomask registration and overlay metrology with PROVE using 2D correlation methods;Seidel,2011

5. Registration performance on EUV masks using high-resolution registration metrology;Steinert,2016

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