High-efficiency vertically-emitting chipsets for 3D and proximity sensing-Reference-Cited by-同舟云学术

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High-efficiency vertically-emitting chipsets for 3D and proximity sensing

Published:2021-03-05 Issue: Volume: Page:
ISSN:
Container-title:High-Power Diode Laser Technology XIX
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Author:

Nechay Kostiantyn,Ulkuniemi Riina,Filipchuk Anna,Hartikainen Timo,Kaivosoja Visa,Hietikko Riina,Nikkinen Jari,Sillanpaa Jari,Melanen Petri,Vilokkinen Ville,Talmila Soile,Uusimaa Petteri

Publisher

SPIE

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. High Slope Efficiency Double and Triple Junction 808 nm Vertical Cavity Surface Emitting Lasers;IEEE Photonics Technology Letters;2023-05-15

2. Thermal management optimization in high-power 3D sensing VCSELs;Components and Packaging for Laser Systems VIII;2022-03-04

3. Ultimate Impulse Response and Relative Delay of a Pulsated VCSEL Array at 940 nm for Improving ToF Resolution;2021 European Conference on Optical Communication (ECOC);2021-09-13

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