Hot spot variability and lithography process window investigation by CDU improvement using CDC technique-Reference-Cited by-同舟云学术

Hot spot variability and lithography process window investigation by CDU improvement using CDC technique

Published:2018-03-20 Issue: Volume: Page:
ISSN:
Container-title:Optical Microlithography XXXI
language:
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Author:

Geh Bernd,Bitensky Alla,Samy Aravind Narayana,Sczyrba Martin,Thamm Thomas,Seltmann Rolf,Djordjevic Kaufmann Marija

Publisher

SPIE

Reference7 articles.

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2. CD process control through machine learning;Clemens,2016

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4. The study for close correlation of mask and wafer to optimize wafer field CD uniformity;Kim,2007

5. Intrafield CDU improvement by using advanced Mask Inspection Data;Hertzsch,2013

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