Study on overlay AEI-ADI shift on contact layer of advanced technology node

Author:

Deng Guogui1,Hao Jingan1,Xiao Lihong1,Xing Bin1,Jiang Yuntao1,He Kaiting1,Zhang Qiang1,He Weiming1,Liu Chang1,Lin Yi-Shih1,Wu Qiang1,Shi Xuelong1

Affiliation:

1. Semiconductor Manufacturing International Corp. (China)

Publisher

SPIE

Reference5 articles.

1. Reduction of image-based ADI-to-AEI overlay inconsistency with improved algorithm

2. Simulation of Non-Uniform Wafer Geometry and Thin Film Residual Stress on Overlay Errors;Veeraraghaven,2011

3. Relationship between localized wafer shape changes induced by residual stress and overlay errors;Turner,2011

4. Predicting distortions and overlay errors due to wafer deformation during chucking on lithography scanners;Turner,2010

5. Overlay similarity: a new overlay index for metrology tool and scanner overlay fingerprint methodology

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