LWR enhancement for 300mm track processing-Reference-Cited by-同舟云学术

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LWR enhancement for 300mm track processing

Published:2018-03-13 Issue: Volume: Page:
ISSN:
Container-title:Advances in Patterning Materials and Processes XXXV
language:
Short-container-title:

Author:

Stokes Harold W.,Harumoto Masahiko,Asai Masaya,Tanaka Yuji,Nakayama Chisayo,Pieczulewski Charles,Vandereyken Jelle,Drent Waut

Publisher

SPIE

Reference13 articles.

1. EUV progress toward HVM readiness;Turkot,2016

2. Exploring the readiness of EUV photo materials for patterning advanced technology nodes;De Simone,2017

3. EUV mask infrastructure readiness and gaps for TD and HVM;Liang,2015

4. Getting ready for EUV in HVM;Dicker,2015

5. EUV process improvement with novel litho track hardware;Stokes,2017

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Pattern collapse mitigation by controlling atmosphere during development process for semiconductor lithography;Japanese Journal of Applied Physics;2021-04-13

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