Advancements in laser diode chip and packaging technologies for application in kW-class fiber laser pumping-Reference-Cited by-同舟云学术

Advancements in laser diode chip and packaging technologies for application in kW-class fiber laser pumping

Published:2014-03-07 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
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Author:

Zucker Erik,Zou Daniel,Zavala Laura,Yu Hongbo,Yalamanchili Prasad,Xu Lei,Xu Hui,Venables David,Skidmore Jay,Rossin Victor,Raju Reddy,Peters Matthew,Liao Kai-Hsiu,Lee Kong-Weng,Kharlamov Boris,Hsieh Allen,Gurram Rupa,Guo James,Guerin Nicolas,Gregg Jeff,Duesterberg Richard,Du Jihua,Demir Abdullah,Cheng Peter,Cheng Jane,Ishiguro Hiroaki,Li Ruotao,Mizoguchi Yuya,Sako Hiroshi

Publisher

SPIE

Reference3 articles.

1. Hausken, T., “The Worldwide Market for Lasers,” 5th edition, Strategies Unlimited, Mountain View, CA, Chapter 3 (2012).

2. High-power, high-efficiency fiber-coupled multimode laser-diode pump module (9XX nm) with high-reliability;Yalamanchili,2008

3. 100W high-brightness multi-emitter laser pump;Duesterberg,2011

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