1.3 µm U-bend traveling wave SOA devices for high efficiency coupling to silicon photonics-Reference-Cited by-同舟云学术

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1.3 µm U-bend traveling wave SOA devices for high efficiency coupling to silicon photonics

Published:2019-03-04 Issue: Volume: Page:
ISSN:
Container-title:Silicon Photonics XIV
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Author:

Viheriälä Jukka,Tuorila Heidi,Zia Nouman,Cherchi Matteo,Aalto Timo,Guina Mircea

Publisher

SPIE

Reference7 articles.

1. On-chip light sources for silicon photonics

2. GaAs-SOI integration as a path to low-cost optical interconnects;Aalto,2011

3. Dramatic size reduction of waveguide bends on a micron-scale silicon photonic platform

4. The Euler bend: paving the way for high-density integration on micron-scale semiconductor platforms;Cherchi;SPIE Photonics West 2014-OPTO Optoelectron. Devices Mater.,2014

5. High-gain 13 μm GaInNAs semiconductor optical amplifier with enhanced temperature stability for all-optical signal processing at 10 Gb/s

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. SOA Model and Design Guidelines in Lossless Photonic Subsystem;New Advances in Semiconductors;2022-06-15

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