Smart implant-layer overlay metrology to enable fab cycle time reduction-Reference-Cited by-同舟云学术

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Smart implant-layer overlay metrology to enable fab cycle time reduction

Published:2019-03-26 Issue: Volume: Page:
ISSN:
Container-title:Metrology, Inspection, and Process Control for Microlithography XXXIII
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Author:

van Dijk Leon,Hasibi Faegheh,Larrañaga Maialen,Pastol Anne,Lam Auguste,van Haren Richard J. F.

Publisher

SPIE

Reference16 articles.

1. Virtual metrology white paper;Orji;IEEE - International Roadmap for Devices and Systems (IRDS) 2017 edition,2018

2. The Elements of Statistical Learning

3. Wafer-shape based in-plane distortion predictions using superfast 4g metrology;van Dijk,2017

4. Reduction in overlay error from mark asymmetry using simulation, orion, and alignment models;Menchtchikov,2018

5. Overlay breakdown methodology on immersion scanner;Lam,2010

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Machine Learning-Based Edge Placement Error Analysis and Optimization: A Systematic Review;IEEE Transactions on Semiconductor Manufacturing;2023-02

2. Computational overlay as enabler for enhanced on-product overlay control;2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC);2022-05-02

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