Effect of chip and bonding defects on the junction temperatures of high-brightness light-emitting diodes

Author:

Weaver Stanton

Publisher

SPIE-Intl Soc Optical Eng

Subject

General Engineering,Atomic and Molecular Physics, and Optics

Reference10 articles.

1. Lumileds Lighting, http://www.lumileds.com/technology (2004).

2. International Technology Roadmap for Semiconductors, http://public.itrs.net (2003).

3. M. Arik, J. Petroski, and S. Weaver , “Thermal challenges in the future generation solid state lighting applications: light emitting diodes,” Presented at ASME/IEEE INTERPACK 2001 Conf., July 2001, Kauai, Hawaii.

4. M. Arik, S. Weaver, C. Becker, M. Hsing, and A. Srivastava , “Effects of localized heat generations due to the color conversion in phosphor particles and layers of high brightness light emitting diodes,” Presented at ASME/IEEE Int. Electronic Packaging Technical Conf. and Exhibition—InterPACK’03, July 6–11, 2003.

5. H. Rainer , “Thermal management of Golden Dragon LED,” http://www.flotherm.com, (Aug. 2002).

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