1. Solder Bumping-a flexible Joining Approach for the Precision Assembly of optoelectronical Systems. Micro-Assembly Technologies and Applications. Ifip Tc5 Wg5.5 Fourth International Precision Assembly Seminar (Ipas’2008) Chamonix, France, February 10–13, 2008;Beckert,2008
2. Automated Assembly of Fast Axis Collimation (FAC) Lenses for Diode Laser Bar Modules Photonics West 2009, San Jose, 26. January 2009, PW09L-LA107-7198-15 Wash;Miesner,2009
3. Automated alignment of optical components for high-power diode lasers;Brecher,2012
4. Automated assembly of VECSEL components
5. SCALAB. Scalable Automation for Emerging Lab Production;Garlich,2012