1. Resolution enhancement of 157 nm lithography by liquid immersion
2. S. Robertson, J. Leonard, J. Alexander, F. Huby, and K. Willey , “Characterization and meaningful quantification of resist component leaching into immersion fluid,” presented at the Immersion and 157 nm Lithography Symposium, Vancouver, BC (2004).
3. W. Hinsberg, G. Wallraff, C. Larson, B. Davis, V. Deline, S. Raoux, D. Miller, F. Houle, J. Hoffnagle, L. Sundberg, R. Dammel, and W. Conley , “Liquid immersion lithography for 193 nm: Resist-liquid interactions status and update,” presented at the 2nd Immersion Lithography Workshop, July 11, 2003, Almaden, CA, IBM.
4. R. J. LeSuer, F. F. Fan, and A. J. Bard , “Understanding interfacial diffusion of ionic species in 193 immersion lithography using scanning electrochemical microscopy,” presented at the 3rd Immersion Workshop, Jan. 27, 2004, Los Angeles, CA.
5. C. Taylor , “Photoresist component extraction measurements using radiochemical analysis,” presented at the 3rd Immersion Workshop, Jan. 27, 2004, Los Angeles, CA.