1. Performance of tri-layer process required for 22nm and beyond;Yayi,2011
2. High etching selectivity of spin-on-carbon hard mask process for 22nm node and beyond;Fumiko,2012
3. Process variability of self-aligned multiple patterning;Kenichi,2013
4. Spin-on-Carbon-Hardmask with high wiggling resistance;Yasunobu,2012