A review on efficient heat-dissipating coatings for applications in thermal management technology of electronic components-Reference-Cited by-同舟云学术

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A review on efficient heat-dissipating coatings for applications in thermal management technology of electronic components

Published:2022-04-25 Issue: Volume: Page:
ISSN:
Container-title:2nd International Conference on Mechanical, Electronics, and Electrical and Automation Control (METMS 2022)
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Author:

Xu Yuxuan,Xiong Guoyao,Li Peng

Publisher

SPIE

Reference18 articles.

1. Research progress on thermoelectric cooling technology applied in electronic packaging thermal management;Wang;J. Electronic Components and Materials,2008

2. Effect of powder process on copper tungsten and copper coating;Deng;J. Journal of Anhui University of Engineering,2018

3. Research Progress of Preparation and Performance of High Thermal Conductivity Coatings. J;Lin;Surface Technology,2021

4. Preparation and properties of micro-nanocarbon composite water-borne cooling coatings. D;Liu,2019

5. Preparation and Application of a High-Performance Heat Radiation Coating;Zhang;J. Yunnan Electric Power,2019

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