Alignment-tolerant structures for ease of optoelectronic packaging-Reference-Cited by-同舟云学术

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Alignment-tolerant structures for ease of optoelectronic packaging

Published:1999-04-14 Issue: Volume: Page:
ISSN:0277-786X
Container-title:Testing, Packaging, Reliability, and Applications of Semiconductor Lasers IV
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Author:

Dagenais Mario,Saini Simarjeet S.,Vusirikala Vijayanand,Bartolo Robert E.,Whaley, Jr. Ralph D.,Dilli Z.,Hu Y.,Fan Zhencan F.,Johnson F. G.,Shen Paul H.,Pamulapati Jagadeesh,Zhou Weimin,Stone Dennis

Publisher

SPIE

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A 2 x 2 crosspoint switch fabricated on the passive active resonant coupler (PARC) platform;IEEE Photonics Technology Letters;2001

2. Passive active resonant coupler (PARC) platform with mode expander;IEEE Photonics Technology Letters;2000-08

3. Lossless 1 x 2 optical switch monolithically integrated on a passive active resonant coupler (PARC) platform;IEEE Photonics Technology Letters;2000-07

4. Passive active resonant coupler platform with tapered passive waveguide;Electronics Letters;2000

5. Taper Length Variation in Passive Active Resonant Coupler (PARC) Platform;Integrated Photonics Research;2000

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