RVS WFIRST sensor chip assembly development results-Reference-Cited by-同舟云学术

RVS WFIRST sensor chip assembly development results

Published:2016-08-05 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
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Author:

Starr Barry¹,Mears Lynn¹,Fulk Chad¹,Getty Jonathan¹,Corrales Elizabeth¹,Nelson David¹,Content David²,Cheng Edward³,Hill Robert J.³,Mah Jonathan³,Waczynski Augustyn²,Wen Yiting²

Affiliation:

1. Raytheon Co. (United States)

2. NASA Goddard Space Flight Ctr. (United States)

3. Conceptual Analytics, LLC (United States)

Publisher

SPIE

Reference13 articles.

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2. Optical Design of the WFIRST-AFTA Wide-Field Instrument;Pasquale,2014

3. Historical perspectives on HgCdTe material and device development at Raytheon Vision Systems;Bratt,2009

4. Large format MBE HgCdTe on silicon detector development for Astronomy;Hanold,2015

5. Megapixel and Larger Readouts and FPAs for Visible and Infrared Astronomy;Gulbransen,2002

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