THz interconnect for inter-/intra-chip communication
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Publisher
SPIE
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1. Design and Analysis of a Mode-Coupler-Based Multimode Multidrop Si Dielectric Waveguide Channel for Sub-THz/THz Interconnect;IEEE Transactions on Microwave Theory and Techniques;2024-01
2. G-Band Mode-Coupler-Based Si Dielectric Waveguide for Multidrop Sub-THz Interconnect;IEEE Microwave and Wireless Technology Letters;2023-06
3. Terahertz metadevices for silicon plasmonics;Chip;2022-12
4. Accurate Crosstalk Noise Modeling and Analysis of Non-Identical Lossy Interconnections Using Convex Optimization Method;IEEE Transactions on Circuits and Systems I: Regular Papers;2022-10
5. Multiplexing Schemes for sub-THz/THz Interconnects (Invited);2022 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT);2022-08-29
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