Advances in photonics thermal management and packaging materials
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SPIE
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Al-Si controlled expansion alloys for electronic packaging applications;Progress in Materials Science;2024-08
2. Improving Performance of GaAs-Based Vertical-Cavity Surface-Emitting Lasers by Employing Thermally Conductive Metal Substrate;ECS Journal of Solid State Science and Technology;2021-01-01
3. Effect of Thermal Management on the Performance of VCSELs;IEEE Transactions on Electron Devices;2020-09
4. Synthesis and characterization of the pearlescent pigments based on mica deposited with SiO2, AlN and TiO2: First report of its dielectric properties;Ceramics International;2020-08
5. 3.23 Polymer Matrix Composite Thermal Materials;Comprehensive Composite Materials II;2018
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