Study on defective elements from indium bump preparation in focal plane array fabrication-Reference-Cited by-同舟云学术

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Study on defective elements from indium bump preparation in focal plane array fabrication

Published:2016-10-25 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
language:
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Author:

Hou Zhijin¹,Fu Li¹,Si Junjie²,Wang Wei²,Lv Yanqiu²,Lu Zhengxiong²,Wang Jinchun²

Affiliation:

1. Northwestern Polytechnical Univ. (China)

2. Luoyang Optoelectro Technology Development Ctr. (China)

Publisher

SPIE

Reference6 articles.

1. Advanced large-format InSb IR FPA maturation at CMC Electronics

2. Ordering of spontaneously formed buckles on planar surfaces, Langmuir;Huck,2000

3. Stress in InSb infrared focal plane array detector analyzed with ansys[J];Qing-Duan;J.Infrared Millim.Waves,2010

4. Characterization of Impurities and Defects in InSb and HgCdTe using Novel Magneto-Optical Techniques;Littler,1993

5. Indium antimonide large-format detector Arrays, Optical Engineering;Davis,2011

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