Full-chip correction of implant layer accounting for underlying topography-Reference-Cited by-同舟云学术

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Full-chip correction of implant layer accounting for underlying topography

Published:2012-02-21 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
language:
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Author:

Oh Minchul,Youn Hyungjoo,Chung Noyoung,Maeng Jaeyeol,Lee Sukjoo,Ku Jahum,Dave Aasutosh,Sturtevant John L.,Hollerbach Uwe,Do Thuy,Granik Yuri,Adam Kostas,Kim Juhwan,Zhu Cynthia,Jung S. W.

Publisher

SPIE

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. KrF Photoresist Profile Modulation by NH3 Plasma Treatment for 28 nm SRAM;IEEE Transactions on Semiconductor Manufacturing;2018-05

2. Mitigating the influence of wafer topography on the implantation process in optical lithography;Optics Letters;2017-07-24

3. Simple method for decreasing wafer topography effect for implant mask;SPIE Proceedings;2016-03-15

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