Publisher
SPIE-Intl Soc Optical Eng
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference7 articles.
1. J. e. Liu ,Conductive adhesives for electronics packaging, Electrochemical Publications, Isle of Man (1999).
2. Thermal conductivity of epoxy adhesives filled with silver particles
3. Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique
4. H. Kristiansen, M. M. V. Taklo, J. Gakkestad, P. Dalsjo, R. Johannessen, F. Oldervoll, and V. H. Nguyen , “Development of low modulus conductive adhesive for MEMS interconnects,”Proc. Pan Pac. Microelectron. Symp., pp. 306–310 (2009).
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