Wafer warpage characterization measurement with modified fringe reflection method-Reference-Cited by-同舟云学术

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Wafer warpage characterization measurement with modified fringe reflection method

Published:2015-06-22 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
language:
Short-container-title:

Author:

Chang Po-Yi,Ku Yi-Sha

Publisher

SPIE

Reference7 articles.

1. Phase shifting method for retroreflective grating analysis;Zhang,1988

2. Retroreflective grating generation and analysis for surface measurement

3. Retroreflective projection gratings

4. Specular surface measurement based on fringe reflection;Zu,2013

5. Wafer level warpage characterization of 3D interconnect processing wafers;Chang,2012

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