<title>Research on VCSEL interconnect and OE processing research at Army Research Laboratory

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Research on VCSEL interconnect and OE processing research at Army Research Laboratory

Published:2000-05-01 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
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Author:

Simonis George J.,Liu J. Jiang,Koley Bikash,Dagenais Mario,Mait Joseph N.,Newman Peter G.,Lawler Bill,Chang Wayne H.,Shen Paul H.,Taysing-Lara Monica A.,Datta Madhumita

Publisher

SPIE

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. High-yield flip-chip bonding and packaging of low-threshold VCSEL arrays on sapphire substrates;IEEE Transactions on Components and Packaging Technologies;2003-09

2. Multichannel optical interconnects for optical communication and processing at tens of Gbits/s;SPIE Proceedings;2003-08-19

3. Multichannel ultrathin silicon-on-sapphire optical interconnects;IEEE Journal of Selected Topics in Quantum Electronics;2003-03

4. Three-dimensional optoelectronic stacked processor by use of free-space optical interconnection and three-dimensional VLSI chip stacks;Applied Optics;2002-01-10

5. High-bandwidth multichannel optoelectronic interconnects for parallel data and image transmission and processing;SPIE Proceedings;2001-05-30

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