1. Nondestructive measurement of in-plane residual stress in silicon strips;Zheng,2000
2. Measurement of residual stress in single crystal silicon wafers;Vrinceanu,2002
3. On-line measurement of thermally induced warpage of BGA’s with high sensitivity shadow Moiré;Wang,1998
4. Twyman-Green interferometer;Malacara,1992
5. An electronic speckle pattern interferometer for complete in-plane displacement measurement