Thermal deformation variations with field positions on the wafer and resist types (CAR and MOR)-Reference-Cited by-同舟云学术

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Thermal deformation variations with field positions on the wafer and resist types (CAR and MOR)

Published:2023-11-21 Issue: Volume: Page:
ISSN:
Container-title:International Conference on Extreme Ultraviolet Lithography 2023
language:
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Author:

Ko Hee-Chang,Kim Min-Woo,Kang Ji-Won,Oh Hye-Keun

Publisher

SPIE

Reference9 articles.

1. On-product overlay solutions for DUV and EUV mix-scanner usage in an EPE-driven patterning world;Slotboom,2022

2. Cross-platform (NXE-NXT) machine-tomachine overlay matching supporting next node chip manufacturing;Thijssen,2018

3. Modeling and Control of Thermomechanical Systems: Managing Heat-Induced Deformation in Extreme Ultraviolet Lithography;Veldman,2020

4. Possible extreme ultraviolet mask thermal deformation during exposure;Ban;J. Micro/Nanopatterning, Mater. Metrol.,2021

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