Across wafer CD uniformity optimization by wafer film scheme at double patterning lithography process-Reference-Cited by-同舟云学术

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Across wafer CD uniformity optimization by wafer film scheme at double patterning lithography process

Published:2014-04-02 Issue: Volume: Page:
ISSN:0277-786X
Container-title:Metrology, Inspection, and Process Control for Microlithography XXVIII
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Author:

Lin Hsiao-Chiang,Li Yang-Liang,Wang Shiuan-Chuan,Liu Chien-Hung,Wang Zih-Song,Hsuh Jhung-Yuin

Publisher

SPIE

Reference5 articles.

1. Time-based PEB adjustment for optimizing CD distributions;Friedberg,2004

2. Positive and Negative Tone Double Patterning Lithography For 50nm Flash Memory;Lim,2006

3. Across-wafer CD Uniformity Control Through Lithography and Etch Process: Experimental Verification;Zhang,2007

4. Double patterning lithography for 32nm: critical dimensions uniformity and overlay control considerations;Finders,2009

5. How to Minimize CD Variation and Overlay Degradation Induced by Film Stress;Jung,2012

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Reduction of Critical Dimension Difference in Litho-Etch-Litho- Etch Double Patterning Process;Journal of Photopolymer Science and Technology;2015

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