Next generation of cooling approaches for diode laser bars
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SPIE
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. A narrow shape double-layer microchannel heat sink (DL-MCHS) designed for high-power laser crystal;Applied Thermal Engineering;2022-07
2. High-power and high-temperature operation of an InGaN laser over 3 W at 85 °C using a novel double-heat-flow packaging technology;Japanese Journal of Applied Physics;2016-03-09
3. Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging;Packaging of High Power Semiconductor Lasers;2014-04-12
4. Thermal Stress in High Power Semiconductor Lasers;Packaging of High Power Semiconductor Lasers;2014-04-12
5. Optical design and development of a fiber coupled high-power diode laser system for laser transmission welding of plastics;Optical Engineering;2012-12-05
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