Direct hot embossing of microelements by means of photostructurable polyimide-Reference-Cited by-同舟云学术

Direct hot embossing of microelements by means of photostructurable polyimide

Published:2016-08-23 Issue:3 Volume:15 Page:034506
ISSN:1932-5150
Container-title:Journal of Micro/Nanolithography, MEMS, and MOEMS
language:en
Short-container-title:J. Micro/Nanolith. MEMS MOEMS

Author:

Akin Meriem¹,Rezem Maher²,Rahlves Maik²,Cromwell Kevin¹,Roth Bernhard²,Reithmeier Eduard³,Wurz Marc Christopher¹,Rissing Lutz¹,Maier Hans Juergen¹

Affiliation:

1. Leibniz Universitaet Hannover, Institute of Micro Production Technology, An der Universitaet 2, 30823 Garbsen, Germany

2. Leibniz Universitaet Hannover, Hanover Centre of Optical Technologies, Nienburger Straße 17, 30167 Hanover, Germany

3. Leibniz Universitaet Hannover, Institute of Measurement and Automatic Control, Nienburger Straße 17, 30167 Hanover, Germany

Publisher

SPIE-Intl Soc Optical Eng

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference14 articles.

1. Fabrication of large-core 1 x 16 optical power splitters in polymers using hot-embossing process

2. Hot embossing for micropatterned cell substrates

3. Influence of master fabrication techniques on the characteristics of embossed microfluidic channels

4. Silicon as tool material for polymer hot embossing

5. Nanofabrication using hot embossing lithography and electroforming

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Towards fabrication and application of polymer based photonics networks and sensors;MOEMS and Miniaturized Systems XVII;2018-02-22

2. Exploration of photosensitive polyimide as the modification layer in thin film microcircuit;Journal of Semiconductors;2018-02