Novel lithography approach using feed-forward mask-based wafer CDU correction increase fab productivity and yield-Reference-Cited by-同舟云学术

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Novel lithography approach using feed-forward mask-based wafer CDU correction increase fab productivity and yield

Published:2009-03-13 Issue: Volume: Page:
ISSN:0277-786X
Container-title:Metrology, Inspection, and Process Control for Microlithography XXIII
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Author:

Mangan Shmoolik,Byers Erik,Rost Dan,Garrett Mike,Carlson Merri,Hickman Craig,Finders Jo,Luehrmann Paul,Kazinczi Robert,Minnaert-Janssen Ingrid,Duray Frank,Wisse Baukje,Schoumans Nicole,Reijnen Liesbeth,Theeuwes Thomas,Ben-Yishai Michael,Ren Rachel,Gibson Ryan,Shoval Lior,Cohen Yaron,Elblinger Yair,Englard Ilan

Publisher

SPIE

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Innovated Methodology Improving CD Uniformity for Lithography Using Wafer-Less Dynamic Grouping Process Characteristics;2024 Conference of Science and Technology for Integrated Circuits (CSTIC);2024-03-17

2. Dose Control Strategy using Random Logic Device Patterns and Massive Metrology in a Foundry High Volume Manufacturing Environment;2022 China Semiconductor Technology International Conference (CSTIC);2022-06-20

3. Dose control strategy using random logic device patterns and massive metrology in a foundry high volume manufacturing environment;2021 International Workshop on Advanced Patterning Solutions (IWAPS);2021-12-12

4. Toward 22 nm: fast and effective intrafield monitoring and optimization of process windows and critical dimension uniformity;Journal of Micro/Nanolithography, MEMS, and MOEMS;2011-10-01

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