Incorporating DSA in multipatterning semiconductor manufacturing technologies

Author:

Badr Yasmine,Torres J. A.,Ma Yuansheng,Mitra Joydeep,Gupta Puneet

Publisher

SPIE

Cited by 12 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. New Insights on the Corrosion–Erosion Behavior of 904L Stainless Steel in Phosphoric Acid Containing Impurities;Journal of Bio- and Tribo-Corrosion;2024-01-27

2. Multiple patterning via layout decomposition method for directed self-assembly lithography;Journal of Micro/Nanopatterning, Materials, and Metrology;2023-12-19

3. A Generation solving Layout Decomposition Method for DSA-MP Hybrid Lithography;2022 International Workshop on Advanced Patterning Solutions (IWAPS);2022-10-21

4. Manufacturability Enhancement With Dummy via Insertion for DSA-MP Lithography Using Multiple BCP Materials;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2021-02

5. Novel Guiding Template and Mask Assignment for DSA-MP Hybrid Lithography Using Multiple BCP Materials;Proceedings of the 56th Annual Design Automation Conference 2019;2019-06-02

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