1. Laser Dicing and Subsequent Die Strength Enhancement Technologies for Ultra-thin Wafer;Li,2007
2. Highest-speed dicing of thin silicon wafers with nanosecond-pulse 355nm q-switched laser source using line-focus fluence optimization technique;Bovatsek,2010
3. Dicing of thin Si wafers with a picosecond laser ablation process;Fornaroli,2013
4. Laser Dicing of Silicon and Composite Semiconductor Materials;Sibailly,2004