Fabrication of high aspect ratio structure and its releasing for silicon on insulator MEMS/MOEMS device application-Reference-Cited by-同舟云学术

Fabrication of high aspect ratio structure and its releasing for silicon on insulator MEMS/MOEMS device application

Published:2015-06-23 Issue:2 Volume:14 Page:024502
ISSN:1932-5150
Container-title:Journal of Micro/Nanolithography, MEMS, and MOEMS
language:en
Short-container-title:J. Micro/Nanolith. MEMS MOEMS

Author:

Fan Ji¹,Zhang Wen Ting²,Liu Jin Quan²,Wu Wen Jie²,Zhu Tao²,Tu Liang Cheng¹

Affiliation:

1. Huazhong University of Science and Technology, School of Physics, MOE Key Laboratory of Fundamental Physical Quantities Measurement, Wuhan 430074, ChinabHuazhong University of Science and Technology, Institute of Geophysics, Wuhan 430074, China

2. Huazhong University of Science and Technology, School of Physics, MOE Key Laboratory of Fundamental Physical Quantities Measurement, Wuhan 430074, China

Publisher

SPIE-Intl Soc Optical Eng

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference23 articles.

1. Dry etching of deep cavities in Pyrex for MEMS applications using standard lithography

2. On the origin of the notching effect during etching in uniform high density plasmas

3. A Novel Silicon Nanotips Antireflection Surface for the Micro Sun Sensor

4. Tolerance analysis for comb-drive actuator using DRIE fabrication

5. Deep reactive ion etching of sub-micrometer trenches with ultra high aspect ratio

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