Evaluation of rinse material and process for EUV lithography-Reference-Cited by-同舟云学术

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Evaluation of rinse material and process for EUV lithography

Published:2015-04-06 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
language:
Short-container-title:

Author:

Yamamoto Kazuma,Itani Toshiro

Publisher

SPIE

Reference7 articles.

1. SEMATECH’s Cycles of Learning Test for EUV Photoresist and its applications for Process Improvement;Chun,2014

2. Development of EUV Resist for 16nm Half Pitch

3. Manufacturability improvements in EUV resist processing toward NXE: 3300 processing;Kuwahara,2014

4. Study of LWR Reduction and Pattern Collapse Suppression for 16-nm Node EUV Resists;Shiobara,2013

5. EUV Resist Process Development at EIDEC;Shiobara,2012

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Development of fluoro-free surfactant rinse solutions for EUV photoresists;International Conference on Extreme Ultraviolet Lithography 2021;2021-10-12

2. Pattern collapse mitigation by controlling atmosphere during development process for semiconductor lithography;Japanese Journal of Applied Physics;2021-04-13

3. Novel Rinse Material to Improve EUV Lithography Performance;Journal of Photopolymer Science and Technology;2016

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