Patterning vertical sidewall for optical assembly-Reference-Cited by-同舟云学术

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Patterning vertical sidewall for optical assembly

Published:2021-03-09 Issue:02 Volume:1 Page:
ISSN:2708-5260
Container-title:Journal of Optical Microsystems
language:
Short-container-title:J. Optical Microsystems

Author:

Yamamoto Taichi¹,Kubo Hironori¹,Kumagai Shinya²,Saito Shigenori³,Sahara Fumitaka³,Wasa Kenji⁴,Sasaki Minoru¹

Affiliation:

1. Toyota Technological Institute, Department of Advanced Science and Technology, Nagoya

2. Meijo University, Department of Electrical and Electronic Engineering, Nagoya

3. Aicello Corporation, Toyohashi

4. Microtex Labs Inc., Tokyo

Publisher

SPIE-Intl Soc Optical Eng

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Uniform resist film on chip substrate prepared by bonding film coated on sheet;2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D);2021-10-05

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