Thermomechanical local stress in assembled GaN LEDs investigated by Raman optical spectroscopy-Reference-Cited by-同舟云学术

Thermomechanical local stress in assembled GaN LEDs investigated by Raman optical spectroscopy

Published:2019-04-26 Issue: Volume: Page:
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Container-title:Integrated Optics: Design, Devices, Systems, and Applications V
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Author:

Signorini Raffaella,Conti Fosca,Brugnolotto Enrico,Pedron Danilo,Liu E.,Bhogaraju SriKrishna,Elger Gordon

Publisher

SPIE

Reference24 articles.

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4. In-Situ measurements of the relative thermal resistance: Highly sensitive method to detect crack propagation in solder joints

5. Detection of solder joint cracking of high power leds on AI-IMS during temperature shock test by transient thermal analysis

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3. Finite Element simulations and Raman measurements to investigate thermomechanical stress in GaN-LEDs;2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC);2020-09-15

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