1. Solving next generation (1x node) metrology challenges using advanced CDSEM capabilities: tilt, high energy and backscatter imaging;Zhang,2015
2. Line edge roughness frequency analysis for SAQP process;Sun,2016
3. Comparison of left and right side line-edge roughness in lithography;Sun,2016
4. Directed self-assembly aware restricted design rule and its impact on design ability;Chen,2016