High-resolution, high-throughput, CMOS-compatible electron-beam patterning-Reference-Cited by-同舟云学术

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High-resolution, high-throughput, CMOS-compatible electron-beam patterning

Published:2017-03-27 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
language:
Short-container-title:

Author:

Smith Melissa A.¹,Vitale Steven A.¹,Fedynyshyn Theodore H.¹,Cook Matthew T.¹,Maldonado Joel¹,Shapiro Dmitri¹,Rothschild Mordechai¹

Affiliation:

1. MIT Lincoln Lab. (United States)

Publisher

SPIE

Reference20 articles.

1. Limits of Conventional Lithography;Tennant,1999

2. Resists for sub-20-nm electron beam lithography with a focus on HSQ: state of the art

3. Hybrid optical: electron-beam resists

4. Looking into the crystal ball: future device learning using hybrid e-beam and optical lithography (Keynote Paper);Steen,2005

5. Brewer Science, Inc, Brewer Science OptiStack System: Leading-Edge Lithography Solutions for 14-nm and beyond Data Sheet, (8 2014).

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1. ICPECVD-Dielectric Thin-Films CMOS-Compatible: Trends in Eco-Friendly Deposition;International Journal of Precision Engineering and Manufacturing-Green Technology;2021-08-02

2. Optical nondestructive dynamic measurements of wafer-scale encapsulated nanofluidic channels;Applied Optics;2018-05-18

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