Techniques for improving overlay accuracy by using device correlated metrology targets as reference-Reference-Cited by-同舟云学术

Techniques for improving overlay accuracy by using device correlated metrology targets as reference

Published:2014-12-02 Issue:4 Volume:13 Page:041412
ISSN:1932-5150
Container-title:Journal of Micro/Nanolithography, MEMS, and MOEMS
language:en
Short-container-title:J. Micro/Nanolith. MEMS MOEMS

Author:

Tzai Wei Jhe¹,Hsu Simon C. C.¹,Chen Howard¹,Chen Charlie¹,Pai Yuan Chi¹,Yu Chun-Chi¹,Lin Chia Ching¹,Itzkovich Tal²,Yap Lipkong³,Amit Eran²,Tien David³,Huang Eros⁴,Kuo Kelly T. L.⁴,Amir Nuriel²

Affiliation:

1. United Microelectronics Corporation, Fab12 Engineering, No.18, Nan-Ke 2nd. Rd., Science-based Industrial Park, Hsin-Shi Tainan Country 744, Taiwan

2. KLA-Tencor Israel, Optical Metrology Division Application, 1 Halavyan St. Migdal Ha’emek, 23100, Israel

3. KLA-Tencor Corporation United States, Optical Metrology Division Application, One Technology Drive, Milpitas, California 95035, United States

4. KLA-Tencor Taiwan, Optical Metrology Division Application, Tai Yuen Hi-Tech Industrial Park, No. 22 Taiyuan Street, Zhubei City ChuPei City, HsinChu Hsien Hsinchu County 302, Taiwan

Publisher

SPIE-Intl Soc Optical Eng

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference3 articles.

1. Overlay accuracy calibration

2. Innovative fast technique for overlay accuracy estimation using archer self calibration (ASC)

3. DCM: device correlated metrology for overlay measurements

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