Chemical mechanical polishing of boron-doped polycrystalline silicon-Reference-Cited by-同舟云学术

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Chemical mechanical polishing of boron-doped polycrystalline silicon

Published:2014-03-07 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
language:
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Author:

Pirayesh Hamidreza,Cadien Kenneth

Publisher

SPIE

Reference19 articles.

1. Full profile inter-layer dielectric CMP analysis;Chang,2000

2. Microelectronic Applications of Chemical Mechanical Planarization

3. Fundamental Tribological and Removal Rate Studies of Inter-Layer Dielectric Chemical Mechanical Planarization

4. Tribology in chemical-mechanical planarization;Liang,2004

5. The theory and design of plate glass polishing machines;Preston,1927

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. In Situ Doped Polysilicon (ISDP) Hydrophilic Direct Wafer Bonding for MEMS Applications;ECS Journal of Solid State Science and Technology;2021-06-01

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