Development of new maleimides applied to spin-on carbon hardmask with characteristics of high heat resistance and good planarization-Reference-Cited by-同舟云学术

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Development of new maleimides applied to spin-on carbon hardmask with characteristics of high heat resistance and good planarization

Published:2019-03-25 Issue: Volume: Page:
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Container-title:Advances in Patterning Materials and Processes XXXVI
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Author:

Horiuchi Junya,Makinoshima Takashi,Sato Takashi,Miki Yasushi,Echigo Masatoshi,Ueno Masayoshi,Yamada Koichi

Publisher

SPIE

Reference6 articles.

1. Silicon containing polymer in applications for 193 nm high NA lithography process;Burns,2006

2. Bai, D., Shao, X., Fowler, M. and Tang, T., “Self-leveling planarization materials for microelectronic topography”, US2013/0113086 A1.

3. Allen, R. D., Hart, M. W. and Sooriyakumaran, R., “Planarization over topography with molecular grass materials”, US2013/0125787 A1.

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. New poly-maleimide resin for SOC hardmask with high thermal stability;Advances in Patterning Materials and Processes XXXVII;2020-03-23

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