Life cycle assessment of etching processes for FDSOI transistors technologies-Reference-Cited by-同舟云学术

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Life cycle assessment of etching processes for FDSOI transistors technologies

Published:2024-04-09 Issue: Volume:12499-31 Page:45
ISSN:
Container-title:Advanced Etch Technology and Process Integration for Nanopatterning XIII
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Author:

Renaud Mickael,Sarrazin Aurélien,Lopes-Barbosa Joao,Rivoira Yannick,Servin Isabelle,Boulard François

Publisher

SPIE

Reference16 articles.

1. Intergovernmental Panel on Climate Change, “Summary for Policymakers”, https://www.ipcc.ch/report/ar6/syr/downloads/report/IPCC_AR6_SYR_SPM.pdf (2023)

2. International Energy Agency, CO2 emissions in 2022, https://www.iea.org/reports/co2-emissions-in-2022 (2023)

3. Cradle-to-gate Life Cycle Assessment of CMOS Logic Technologies;Boakes;IEDM,2023

4. Pilot line in the Chips Act;Wion,2023

5. Sustainable semiconductor manufacturing: lessons for lithography and etch;Gallagher;SPIE,2023

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