Waveguide and packaging technology for optical backplanes and hybrid electrical-optical circuit boards-Reference-Cited by-同舟云学术

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Waveguide and packaging technology for optical backplanes and hybrid electrical-optical circuit boards

Published:2006-02-09 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
language:
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Author:

Schröder H.,Bauer J.,Ebling F.,Franke M.,Beier A.,Demmer P.,Süllau W.,Kostelnik J.,Mödinger R.,Pfeiffer K.,Ostrzinski U.,Griese E.

Publisher

SPIE

Cited by 17 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. An optimized routing algorithm for the automated assembly of standard multimode ribbon fibers in a full-mesh optical backplane;Optical Fiber Technology;2018-03

3. Comparison of self-written waveguide techniques and bulk index matching for low-loss polymer waveguide interconnects;Optical Interconnects XVI;2016-03-15

4. A 40 Gb/s Optical Bus for Optical Backplane Interconnections;Journal of Lightwave Technology;2014-04

5. An EpoClad/EpoCore-based platform for MOEMS fabrication;Journal of Micromechanics and Microengineering;2013-10-30

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