<title>In-line failure analysis on productive wafers with dual-beam SEM/FIB systems

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In-line failure analysis on productive wafers with dual-beam SEM/FIB systems

Published:2001-04-23 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
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Author:

Weiland Rainer,Boit Christian,Dawes Nick,Dziesiaty Andreas,Demm Ernst,Ebersberger Bernd,Frey Lothar,Geyer Stefan,Hirsch Alexander,Lehrer Christoph,Meis Peter,Kamolz Matthias,Lezec Henri,Rettenmaier Hans,Tittes Wolfgang,Treichler Rolf,Zimmermann Harald

Publisher

SPIE

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Surface contamination and electrical damage by focused ion beam: conditions applicable to the extraction of TEM lamellae from nanoelectronic devices;Semiconductor Science and Technology;2015-10-15

2. FIB Lift-Out Specimen Preparation Techniques;Introduction to Focused Ion Beams;2005

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