Automated klarf-based defect inspection by electron-beam inspection tool: a novel approach to inline monitoring and/or process change validation-Reference-Cited by-同舟云学术

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Automated klarf-based defect inspection by electron-beam inspection tool: a novel approach to inline monitoring and/or process change validation

Published:2016-04-12 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
language:
Short-container-title:

Author:

Cai Na¹,Zeng Xuefeng¹,Wu Kevin¹,Song Ho Young¹,Gao Weihong¹,Tian Qing²,Lei Chris²,Gao Kewen²,Wang Liuchen²,Zhao Yan²

Affiliation:

1. GLOBALFOUNDRIES Inc. (United States)

2. Hermes Microvision Inc. (United States)

Publisher

SPIE

Reference5 articles.

1. Industry survey on non-visual defect detection,;Boye,2003

2. E-beam inspection system for comparison of wafer and design data,;Patterson,2012

3. Defect metrology challenges at the 11nm node and beyond,;Crimmins,2010

4. Electron beam inspection system for semiconductor wafer based on projection electron microscopy,;Satake,2004

5. Study of devices leakage of 45nm node with different SRAM layouts using an advanced e-beam inspection systems,;Xiao,2009

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. RIE-Induced VIA Defect Inspection Using In-line Voltage Contrast Technique – 0.18 µm Technology;IETE Journal of Research;2023-06-26

2. Smart E-Beam for Defect Identification & Analysis in the Nanoscale Technology Nodes: Technical Perspectives;Electronics;2017-10-20

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