Low-cost TO-CAN package combined with flexible and hard printed circuit boards for 25 - Gb / s optical subassembly modules
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Published:2017-02-08
Issue:2
Volume:56
Page:026108
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ISSN:0091-3286
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Container-title:Optical Engineering
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language:en
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Short-container-title:Opt. Eng
Author:
Jou Jau-Ji1,
Shih Tien-Tsorng1,
Wu Cheng-Ying1,
Su Zhe-Xian1
Affiliation:
1. National Kaohsiung University of Applied Sciences, Department of Electronic Engineering, Kaohsiung, Taiwan
Publisher
SPIE-Intl Soc Optical Eng
Subject
General Engineering,Atomic and Molecular Physics, and Optics