1. New infrared sensors for ballistic missile defense;Tidrow,2005
2. Research on flip-chip bonding techniques for hybrid focal plane array applications;Zhang,2006
3. Strain‐induced current leakage in InSb photovoltaic detectors
4. Stress-limited nonuiformity of InSb focal plane array detectors;Cao,2007
5. Research of polishing technology for InSb semiconductor materials;Xiang,2009