Detection of bonding voids for 3D integration-Reference-Cited by-同舟云学术

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Detection of bonding voids for 3D integration

Published:2023-04-27 Issue: Volume: Page:
ISSN:
Container-title:Metrology, Inspection, and Process Control XXXVII
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Author:

Chen Cong,Van Den Heuvel Dieter,Beggiato Matteo,Tunca Altintas Bensu,Moussa Alain,Vandooren Anne,Baudemprez Bart,Schöbitz Michael,Khaldi Wassim,Bogdanowicz Janusz,Beral Christophe,Charley Anne-Laure

Publisher

SPIE

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Innovative Approaches for 3D Metrology and Defect Analysis on Advanced Packaging Structures;2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC);2024-05-13

2. Evaluation of flip-chip bonding electrical connectivity for ultra-large array infrared detector;Optics Express;2024-03-11

3. Detection of bonding voids in multi-tier stacks with scanning acoustic microscope;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

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