Planar architecture for microstrip interfaced packaging of coplanar-waveguide-based radio frequency microelectromechanical system switches-Reference-Cited by-同舟云学术

Planar architecture for microstrip interfaced packaging of coplanar-waveguide-based radio frequency microelectromechanical system switches

Published:2015-02-27 Issue:1 Volume:14 Page:015002
ISSN:1932-5150
Container-title:Journal of Micro/Nanolithography, MEMS, and MOEMS
language:en
Short-container-title:J. Micro/Nanolith. MEMS MOEMS

Author:

Singh Shailendra¹,Giridhar Malalahalli Sreenivasamurthy²,Rao Cheemalamarri Venkata Narasimha¹,Bhalke Sangam³,Islam Rifqul²

Affiliation:

1. Indian Space Research Organization (ISRO), Space Applications Center, Jodhpur Tekra, Ambawadi Vistar P.O., Ahmedabad 380015, India

2. Indian Space Research Organization (ISRO), Laboratory for Electro Optic Systems, 1st Cross, 1st Stage, Peenya Industrial Area, Bangalore 560058, India

3. Gallium Arsenide Enabling Technology Center, Vignyana Kancha Post, Hyderabad 560069, India

Publisher

SPIE-Intl Soc Optical Eng

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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